Potting, Encapsulation, Dam and Fill

At Electronic Coating Technologies, we apply potting and encapsulation materials to protect printed circuit boards(PCBs) using robotic dispense systems, and variable ratio, meter mix machines. Since each product design and manufacturing process can be complex, it may be difficult to find a material that will exactly meet all the requirements. With our extensive knowledge in the field, we at Electronic Coating Technologies can assist you in finding the most suitable compound to fit your needs.

Potting

Fundamentally, there are three ways in which you could implement a potting/encapsulation compound to your design.

Potting is typically done directly into a plastic or metal housing which has been designed to hold a PCB and allows for access to properly dispense and degas the mixture through pouring. This method usually results in the most protection, as you’re encasing the entire unit in a protective compound in a thick layer. This type of solution provides protection against physical stress, thermal shock, chemical exposure, heat and humidity, all the while providing a great deal of electrical insulation.

The benefits of Potting include:

  • Low cost shells
  • Hermetic like seal
  • Good electrical insulation
  • Can withstand environmental extremes
  • Many different materials with different cured properties

Encapsulation

Dam and fill applications are used wherein specific components or regions require potting, however for whatever reason (space, shape, weight, reworkability, access), the entire board cannot be potted. This technique utilizes a secondary material to build a “dam” in an area to keep the potting compound contained, which is then fully cured prior to filling with the desired potting compound.

Finally, encapsulation is localized application of potting application in a typically thinner amount that cover or “encapsulates” a section or component to provide increased electrical insulation, physical protection, and resistance to environmental extremes.

Benefits of Encapsulation:

  • Low cost of reusable molds
  • Many different materials with varying cured properties
  • Good electrical insulation
  • Hermetic like seal
  • Good resistance to environmental extremes

Potting Compound Types:
1K vs 2K
AR – Pros/Cons
ER – Pros/Cons
UR – Pros/Cons
SR – Pros/Cons
Thermally Conductive
Flame Retardant

Technical Data Sheets

QSil 553 QGell 311

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