Form-in-Place and Cured-in-Place Gaskets
Electronic Coating Technologies applies both electrically conductive and non-conductive form-in-place (FIP) and cured-in-place (CIP) gaskets. At ECT gaskets are applied as a liquid, gel, or paste utilizing a computer-controlled, four-axis dispensing system to ensure proper bead dimensions even on complex geometries. The material is then cured using atmospheric moisture, heat, or high-intensity UV/Visible light to form a rubbery or foam gasket. There are a wide variety of materials with different cured properties, and conductive filler types.
Electrically conductive form-in-place gaskets are utilized to aid with the resistance of electromagnetic interference (EMI/RFI) to electronic assemblies. Seams between joined sections of an enclosure typically have a gasket applied there to reduce the chance for EMI leakage in or out of the unit. With the rise of plastic shielded enclosures replacing metal enclosures, gasket considerations are important as the joints between plastic housings are key points where the shield can fail if a gasket is not used.
Non-Conductive form-in-place gaskets are generally used for sealing against moisture and chemical exposure, sound and vibration dampening, and as a contamination barrier between two substrates. There are many different gaskets out on the market with different cured properties and different curing methods. Properties that drive the selection of non-conductive gaskets are hardness, compression set, environmental and chemical resistance, and adhesion to mating substrates.