Potting & Encapsulation

Electronic Coating Technologies applies encapsulation, and potting materials to insulate printed circuit boards using robotic dispense systems, and variable ratio, meter mix machines. Since each product design and manufacturing process can be complex, it may be difficult to find a material that will exactly meet all the requirements. With our extensive knowledge in the field, we at Electronic Coating Technologies can assist you in finding the most suitable compound to fit your needs.

Potting

Potting is the process of partially or completely filling or embedding an enclosure with a compound for the purpose of providing resistance to shock and vibration, as well as creating a seal against moisture, solvents, and corrosive agents. Potting compounds are also used to aid with electrical insulation, flame retardency and heat dissipation.

The most common types of potting compounds are polyurethane, acrylic, epoxy resin, and silicone. These materials vary in hardness from very soft to hard and rigid, and are designed to withstand many different types of environments. Each of these chemistries does have its own strength and weaknesses though. Determining which compound is best for your application will be based on operating and environmental conditions, material physical properties, and processing needs.

The benefits of Potting include:

  • Low cost shells
  • Hermetic like seal
  • Good electrical insulation
  • Can withstand environmental extremes
  • Many different materials with different cured properties

Encapsulation

Encapsulation is a process similar to Potting. With encapsulation instead of filling a mold with a compound like during the potting process, the electronic assembly is impregnated inside the compound with the help of a reusable mold. Typically the reusable mold is made out of hard to adhere to materials such as Teflon or Silicone. The purpose of encapsulation is to create a protective “shell” around the assembly.

Encapsulation provides resistance to shock and vibration, as well as creating a seal against moisture, solvents, and corrosive agents. Encapsulation is also used to aid with electrical insulation, flame retardency and heat dissipation.

Benefits of Encapsulation:

  • Low cost of reusable molds
  • Many different materials with varying cured properties
  • Good electrical insulation
  • Hermetic like seal
  • Good resistance to environmental extremes

Technical Data Sheets

QSil 553
QGell 311

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