Electronic Coating Technologies applies both conductive and non-conductive form-in-place (FIP) gaskets. At ECT both gasket types are applied as a gel or paste utilizing a computer controlled, three-axis dispensing system to ensure proper bead dimensions even on complex geometries. The material is then cured using atmospheric moisture, heat, or high intensity UV/Visible light to form a rubbery gasket. There are a wide variety of materials with different cured properties, and conductive filler types.
Conductive form-in-place gaskets are utilized to aid with the resistance of electromagnetic interference to the electronic assembly. The material is a mixture of nonconductive elastomer, and electrically conductive filler particles. The conductive fillers typically are metal particles or nonconductive materials like glass that are plated with a conductive metal. Properties that drive the selection of conductive FIP gaskets are electrical properties and EMI shielding effectiveness, hardness, compression set, environmental stability, Galvanic compatibility, and the ability to bond with the mating substrates. The Galvanic compatibility with the mating substrate is a key factor in determining which FIP gasket to use. Improper choice of the conductive filler risks rapid corrosion of the substrates at the gasket seam.
Non-Conductive form-in-place gaskets are generally used for sealing against moisture and chemical exposure, sound and vibration dampening, and as a contamination barrier between two substrates. There are many different FIP gaskets out on the market with different cured properties, and different curing methods. Properties that drive selection of non-conductive FIP gaskets are hardness, compression set, environmental and chemical resistance, and adhesion to mating substrates.
Technical Data Sheets
- Dow Corning