Potting & Encapsulation

We apply potting compounds and Encapsulants to printed circuit boards and assemblies utilizing state of the art programmable meter mix machines.

We will help the customer select the appropriate material for their application based upon the performance requirement of the material.

We will also design silicone mold potting enclosures if required. This eliminates the need for additional potting cases.

Our potting materials include hard tamperproof epoxy compounds, flexible soft urethanes and silicones.   

We have UL 94 VO and V1 rated materials if required.